SE8000
Imaging 3D Thin-Film Thickness Measuring Instrument
Real-time wet-film thickness and reflectance monitoring at the slot-die coating head (MH-TH-310). Upstream process feedback before drying, with published optical range, sampling rate and production-line integration hooks for pilot and process-control development.
Imaging 3D Thin-Film Metrology for Uniformity Analysis
SE8000 is designed for thin-film applications where engineers need to understand thickness distribution across an area rather than relying on isolated measurement points. The imaging approach combines spatial information with thin-film measurement to support multilayer analysis and uniformity evaluation.
Measurement Functions : Imaging-based 3D thickness measurement, Multi-layer film analysis, Thickness distribution, Uniformity visualization, Automatic measurement at defined positions, Continuous spectrum collection
What Makes It Different? : A single point can confirm that a film meets a target. A spatial measurement can show whether the entire sample behaves consistently. SE8000 is designed for applications where film uniformity is part of the measurement objective.
Typical Applications : Semiconductor thin films, PV coatings, Display materials, Optical coatings, Multilayer films, Process development
Published Information : TDM currently publishes the imaging 3D, multilayer and uniformity functions, but does not publish one universal numerical thickness range for SE8000. Final measurement capability should therefore be confirmed against the specific film stack and substrate.
