SE310
Slot die wet film metrology module
Desktop inkjet printing platform for perovskite, semiconductor, display and printed-electronics R&D. Study ink behavior, droplet deposition and printed-film formation before transferring recipes toward larger-scale manufacturing systems.
Real-Time Wet-Film Thickness Monitoring at the Coating Head
MH-TH-310 is an in-situ metrology module designed for slot-die coating processes. It measures wet-film thickness and reflectance directly at the coating head, giving process engineers access to measurement data while the coating process is running.
Measurement Outputs : Wet-film thickness, Reflectance
Production Integration : The detection module is mounted on the coating head. The system communicates with a local computing server and can receive start/stop trigger signals from the slot-die machine.
Why MH-TH-310? : Wet-film thickness is an upstream process variable. Monitoring it before drying allows engineers to investigate coating variation before it becomes a finished-film quality problem.
Typical Applications : Perovskite coating, Slot-die coating, Thin-film PV, Pilot production, Coating process development, Process-control development
